Ing Ind - Inf (Mag.)(ord. 270) - MI (491) MATERIALS ENGINEERING AND NANOTECHNOLOGY - INGEGNERIA DEI MATERIALI E DELLE NANOTECNOLOGIE
080436 - MATERIALS FOR ELECTRONICS
The course is aimed at providing the fundamental concepts of materials and technologies for the production of printed circuit boards, integrated circuits and microelectromechanical (MEMS) devices. For each microelectronic device, the basic principles, the involved materials and the industrial production processes are discussed. In the field of MEMS technology, surface micromachining and surface modification processes at the microscale will be presented.
Risultati di apprendimento attesi
Upon completion of the course, the student will
know and understand the relationship between materials selection and production process in microelectronics;
know the main components of a printed circuit board and its production processes;
know the main components of an integrated circuit and its production processes;
know the main components of a microelectromechanical system and its production processes.
These learning outcomes are expected to provide the students with adequate knowledge tools and critical approach for their future activity related to microelectronics and integration technology.
The main topics of the course are
Printed Circuit Board manufacture: base materials, copper foils, laminate fabrication, solder resist, multilayer PCB, passive and active components, PTH and SMT assembling methods, soldering and solder alloys, flexible printed circuits
Introduction to microfabrication and integrated circuits: semiconductor materials, thin films materials and processes, epitaxy, pattern generation and optical lithography, etching processes, thermal oxidation, diffusion and ion implantation, multi-level metallization, chemical-mechanical planarization
Integration: process integration, CMOS transistor fabrication, bipolar technology, 3D integration and TSV technology
Introduction to MEMS and silicon micromachining: microelectromechanical systems, surface and bulk micromachining, bonding and layer transfer, IC-MEMS integration
A background in chemistry and physics is required.
Modalità di valutazione
The examination will be an oral discussion about the course topics, chosen by the examiner so that different parts of the course syllabus are involved.
The student must be also able to clearly describe and critically discuss the proposed topics, highlighting the assumptions, critical points and industrial processing.
Sami Franssila, Introduction to microfabrication, Editore: Wiley, ISBN: 978-0-470-74983-8
Tipo Forma Didattica
Ore di attività svolte in aula
Ore di studio autonome
Laboratorio Di Progetto
Informazioni in lingua inglese a supporto dell'internazionalizzazione
Insegnamento erogato in lingua
Disponibilità di materiale didattico/slides in lingua inglese
Disponibilità di libri di testo/bibliografia in lingua inglese
Possibilità di sostenere l'esame in lingua inglese
Disponibilità di supporto didattico in lingua inglese