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Risorsa bibliografica obbligatoria
Risorsa bibliografica facoltativa
Scheda Riassuntiva
Anno Accademico 2014/2015
Scuola Scuola di Ingegneria Industriale e dell'Informazione
Insegnamento 096077 - HEAT TRANSFER
Docente Colombo Luigi Pietro Maria
Cfu 5.00 Tipo insegnamento Monodisciplinare

Corso di Studi Codice Piano di Studio preventivamente approvato Da (compreso) A (escluso) Insegnamento
Ing Ind - Inf (Mag.)(ord. 270) - BV (478) NUCLEAR ENGINEERING - INGEGNERIA NUCLEARE* AZZZZ096077 - HEAT TRANSFER
Ing Ind - Inf (Mag.)(ord. 270) - MI (419) INGEGNERIA ELETTRONICA* AZZZZ096077 - HEAT TRANSFER
Ing Ind - Inf (Mag.)(ord. 270) - MI (476) ELECTRONICS ENGINEERING - INGEGNERIA ELETTRONICA* AZZZZ096077 - HEAT TRANSFER

Programma dettagliato e risultati di apprendimento attesi

Objectives

The course aims at introducing the basic theory and applications of heat transfer, focusing in particular on thermal issues of electronic devices. For this reason, lessons are supported by (optional) computer labs to develop fundamentals of thermal analysis by FEM software packages.

 

Programme

 

Lessons (theory and applications)

1) Review of thermodynamics. Systems, equilibrium states, intensive and extensive properties, first and second principle, internal energy, heat, work, entropy.

2) Introduction to transport phenomena. Concept of continuum, non-equilibrium states, local equilibrium. The basic mechanisms of heat transfer: conduction, convection and radiation.

3) Conduction. Fourier’s postulate, Fourier’s equation, dimensional analysis: Biot and Fourier numbers. Steady-state temperature distribution in simple bodies, thermal resistance networks. Fin design. Transient analysis for simple bodies: lumped parameters versus distributed parameters.

4) Introduction to convection. Balance equations for a moving continuum. Laminar and turbulent flow. Hydrodynamic and thermal boundary layer.

5) Forced convection. Dimensional analysis: Reynolds, Prandtl and Nusselt numbers. Correlations between the dimensionless groups for external and internal flows. Introduction to heat exchanger design.

6) Free convection. Buoyancy, dimensional analysis: Grashof, Rayleigh and Nusselt numbers. Correlations between the dimensionless groups.

7) Radiation. Thermal radiation, blackbody radiation, radiative properties of real bodies. Kirchhoff’s law, grey bodies. Radiation heat transfer among grey bodies: view factor, resistance networks.

 

Computer Labs (not mandatory for the final exam)

1) Introduction to the Heat Transfer Module of Comsol Multiphysics®.

2) Modelling steady-state heat conduction.

3) Modelling transient heat conduction.

4) Modelling boundary layers.

5) Thermal analysis of electronic devices (optional project).

 

 


Note Sulla Modalità di valutazione

Examination rules

Exams take place after the end of the lessons according to the rules of the School: no intermediate tests will be held.

The exam consists of a written test including both theory and exercises. At teacher’s discretion oral integration might be required for scores ranging between 18/30 and 20/30 or between 27/30 and 30/30.

The students who have attended Computer Labs may develop an optional project, which is evaluated up to 2/30 in addition to the final score.


Bibliografia
Risorsa bibliografica facoltativaLienhard, J.H., A Heat Transfer Textbook, Editore: Phlogiston Press http://web.mit.edu/lienhard/www/ahtt.html

Mix Forme Didattiche
Tipo Forma Didattica Ore didattiche
lezione
28.0
esercitazione
20.0
laboratorio informatico
0.0
laboratorio sperimentale
6.0
progetto
0.0
laboratorio di progetto
0.0

Informazioni in lingua inglese a supporto dell'internazionalizzazione
Insegnamento erogato in lingua Inglese
schedaincarico v. 1.6.5 / 1.6.5
Area Servizi ICT
25/11/2020