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Scheda Riassuntiva
Anno Accademico 2020/2021
Scuola Scuola di Ingegneria Industriale e dell'Informazione
Insegnamento 055559 - ADVANCED MICRO AND NANOFABRICATION TECHNOLOGIES
Cfu 5.00 Tipo insegnamento Monodisciplinare
Docenti: Titolare (Co-titolari) Cantoni Matteo

Corso di Studi Codice Piano di Studio preventivamente approvato Da (compreso) A (escluso) Insegnamento
Ing Ind - Inf (Mag.)(ord. 270) - MI (486) ENGINEERING PHYSICS - INGEGNERIA FISICA*AZZZZ054860 - MICRO AND NANOSTRUCTURE FABRICATION
054352 - IMAGING AND FABRICATION OF MICRO AND NANOSTRUCTURES (C.I.)
055559 - ADVANCED MICRO AND NANOFABRICATION TECHNOLOGIES

Obiettivi dell'insegnamento

The objective of the course is to introduce the student to the theory and technology of micro- and nano-fabrication, providing her/him with the essential knowledge and experimental skills on the basic and advanced processing techniques. A first section of the course is devoted to the film and heterostructure realization by different deposition techniques, whereas a second section is focused on the realization of devices by conventional and advanced lithography. The experimental activity is carried out at the Polifab micro- and nano-technology center of the Politecnico di Milano. The main goal of the course is to provide the student with the ability to design and realize a conventional process flow for the fabrication of simple electronic and spintronic devices.


Risultati di apprendimento attesi

Knowledge and understanding

Upon passing the exam, the student:

- knows the principles of vacuum technologies

- knows the foundations of surface thermodynamics and epitaxy

- knows the basic physical vapor deposition (PVD) and chemical vapor deposition (CVD) techniques

- knows the physical and operational basis of the lithographic and etching techniques

- understands the difference between the main deposition techniques

- understands the difference between the main lithographic techniques

- understands the difference between the main etching techniques

 

Applying knowledge and understanding

Upon passing the exam, the student:

- is able to design a simple vacuum system

- is able to predict the growth dynamics of a film and an heterostructures

- is able to design a simple lithographic process flow

- is able to choose between different deposition techniques depending on the application

- is able to choose between different lithographic techniques depending on the application

- is able to choose between different etching techniques

 

Making judgements

Upon passing the exam, the student:

- is able to design and realize the process flow for fabricating simple electronic or spintronic devices


Argomenti trattati

Part I - Deposition

  • Introduction: objectives, examples of micro and nano-fabrication
  • Vacuum technology: kinetic theory of gases, gas transport and pumping, vacuum systems
  • Surface thermodynamics: surface properties, homogeneous and heterogeneous nucleation, film growth modes
  • Film epitaxy: mechanisms, lattice orientation, strain
  • Thermal evaporation: calculation of rate and uniformity, examples of electrically heated and e-beam sources, molecular beam epitaxy, pulsed laser deposition
  • Sputtering deposition: plasma physics, sputtering techniques (DC, RF, reactive and magnetron)
  • Chemical Vapor Deposition: reactions, basics of thermodynamics and gas flow, CVD techniques (thermally- and plasma-activated)
  • Characterization techniques: film thickness, structure, stoichiometry

 

Part II - Lithography

  • Introduction to lithography: device scaling, Moore’s law
  • Optical lithography: process flow and technology
  • Physics of optical exposure and resolution enhancement technologies: diffraction, numerical aperture, illuminations, masks, lenses, resists
  • Advanced photolithographic techniques: maskless optical lithography, extreme ultraviolet lithography, X-ray lithography
  • Electron beam lithography: physical principles, process flow and technology
  • Other advanced lithographic techniques: soft and nanoimprint lithography, focused ion beam, scanning probe lithography
  • Pattern transfer: dry and wet etching
  • Examples of lithographic process flows

 

Laboratory activities

An experimental activity will be carried out at Polifab, the micro- and nanotechnology center of the Politecnico di Milano, allowing the student to practice the design and realization of a conventional process flow for the fabrication of a simple spintronic device, such as a Hall bar or a GMR sensor. The student will actively participate to the fabrication process, using some of the deposition and patterning techniques discussed in the course.

 

Schedule

The course will be held in the second half of the first semester, from November to December.


Prerequisiti

The program is designed for students of the Engineering Physics course. Students from Electronic Engineering, Biomedical Engineering, Material Engineering and Nanotechnology may also benefit from this course. Basic knowledge of solid state physic is recommended.


Modalità di valutazione

The examination is oral, on the topics of the course (Part I and Part II).


Bibliografia

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Forme didattiche
Tipo Forma Didattica Ore di attività svolte in aula
(hh:mm)
Ore di studio autonome
(hh:mm)
Lezione
40:00
60:00
Esercitazione
0:00
0:00
Laboratorio Informatico
0:00
0:00
Laboratorio Sperimentale
10:00
15:00
Laboratorio Di Progetto
0:00
0:00
Totale 50:00 75:00

Informazioni in lingua inglese a supporto dell'internazionalizzazione
Insegnamento erogato in lingua Inglese
Disponibilità di materiale didattico/slides in lingua inglese
Disponibilità di libri di testo/bibliografia in lingua inglese
Possibilità di sostenere l'esame in lingua inglese
schedaincarico v. 1.13.0 / 1.13.0
Area Servizi ICT
12/02/2026