The topics of the lectures are divided in two submodules:
- Experiments for materials and interfaces
- Experiments for micro-devices
- Experimental methods to assess and measure interface strength:
- Shear test to characterize bonding layers between silicon wafers.
- Wire tensile test.
- Practical topics for design:
- Experimental setup with parts eventually dedicated to “in-situ” observation: actuators, force and displacements sensors, mechanical part dedicated to manipulate and to grip samples, digital imaging, electronics for data acquisition and control software.
- Examples of design of experimental setup will be proposed by means of CAD software assembly.
- Examples of software codes dedicated to data acquisition and control of instruments will be illustrated (Labview and Matlab code examples).
- Brief review of electrostatics and mechanics fundamentals applied to microsystems.
- Brief review of commonly used microsystems of large diffusion, with emphasis on mechanical measurements in statics and dynamics (e.g. accelerometers, gyroscopes).
- “On-chip” and “off-chip” measurements: capacitive sensing and actuation for laboratory testing in statics and dynamics
- Tests of shear mechanical strength at bonded interfaces.
- Open issues in mechanical measurements at the small scale: limits of the homogeneous continuum approach, scale effects, nonlinearities induced by the electro-mechanical coupling.
Presentation of the facilities at the Laboratory of Micromechanics and Field Measurements.
The project activity developed by the students will be focused on a specific experiment definition with the theoretical topics for results interpretation and the design of the experimental apparatus.
Topics of the projects:
- mechanical behavior of materials and/or interfaces;
- standard techniques for MEMS measurements with existing machines at the Politecnico (e.g. capacitive measurements in statics and dynamics);
- design of new on-chip MEMS testing structures (e.g. microsystems for the evaluation of residual stresses).