logo-polimi
Loading...
Risorse bibliografiche
Risorsa bibliografica obbligatoria
Risorsa bibliografica facoltativa
Scheda Riassuntiva
Anno Accademico 2018/2019
Scuola Scuola di Ingegneria Industriale e dell'Informazione
Insegnamento 080436 - MATERIALS FOR ELECTRONICS
Docente Magagnin Luca
Cfu 5.00 Tipo insegnamento Monodisciplinare

Corso di Studi Codice Piano di Studio preventivamente approvato Da (compreso) A (escluso) Insegnamento
Ing Ind - Inf (Mag.)(ord. 270) - MI (491) MATERIALS ENGINEERING AND NANOTECHNOLOGY - INGEGNERIA DEI MATERIALI E DELLE NANOTECNOLOGIE*AZZZZ080436 - MATERIALS FOR ELECTRONICS

Obiettivi dell'insegnamento

The course is aimed at providing the fundamental concepts of materials and technologies for the production of printed circuit boards, integrated circuits and microelectromechanical (MEMS) devices. For each microelectronic device, the basic principles, the involved materials and the industrial production processes are discussed. In the field of MEMS technology, surface micromachining and surface modification processes at the microscale will be presented.


Risultati di apprendimento attesi

Upon completion of the course, the student will

  • know and understand the relationship between materials selection and production process in microelectronics;
  • know the main components of a printed circuit board and its production processes;
  • know the main components of an integrated circuit and its production processes;
  • know the main components of a microelectromechanical system and its production processes.

These learning outcomes are expected to provide the students with adequate knowledge tools and critical approach for their future activity related to microelectronics and integration technology.


Argomenti trattati

The main topics of the course are

  • Printed Circuit Board manufacture: base materials, copper foils, laminate fabrication, solder resist, multilayer PCB, passive and active components, PTH and SMT assembling methods, soldering and solder alloys, flexible printed circuits
  • Introduction to microfabrication and integrated circuits: semiconductor materials, thin films materials and processes, epitaxy, pattern generation and optical lithography, etching processes, thermal oxidation, diffusion and ion implantation, multi-level metallization, chemical-mechanical planarization
  • Integration: process integration, CMOS transistor fabrication, bipolar technology, 3D integration and TSV technology
  • Introduction to MEMS and silicon micromachining: microelectromechanical systems, surface and bulk micromachining, bonding and layer transfer, IC-MEMS integration

Prerequisiti

A background in chemistry and physics is required.


Modalità di valutazione

The examination will be an oral discussion about the course topics, chosen by the examiner so that different parts of the course syllabus are involved.

The student must be also able to clearly describe and critically discuss the proposed topics, highlighting the assumptions, critical points and industrial processing.


Bibliografia
Risorsa bibliografica facoltativaSami Franssila, Introduction to microfabrication, Editore: Wiley, ISBN: 978-0-470-74983-8

Software utilizzato
Nessun software richiesto

Forme didattiche
Tipo Forma Didattica Ore di attività svolte in aula
(hh:mm)
Ore di studio autonome
(hh:mm)
Lezione
32:30
48:45
Esercitazione
17:30
26:15
Laboratorio Informatico
0:00
0:00
Laboratorio Sperimentale
0:00
0:00
Laboratorio Di Progetto
0:00
0:00
Totale 50:00 75:00

Informazioni in lingua inglese a supporto dell'internazionalizzazione
Insegnamento erogato in lingua Inglese
Disponibilità di materiale didattico/slides in lingua inglese
Disponibilità di libri di testo/bibliografia in lingua inglese
Possibilità di sostenere l'esame in lingua inglese
Disponibilità di supporto didattico in lingua inglese
schedaincarico v. 1.6.9 / 1.6.9
Area Servizi ICT
16/10/2021